■ RELIABILITY DATA
21. Temperature Cycling
Appearance：No abnormality
Capacitance Change：≤ ±7.5%
Q or Dissipation Factor：Dissipation Factor]Initial value shall be satisfied.
Insulation Resistance：Larger than whichever smaller of 500MΩ・µF or 10000MΩ
Specified Value
【Test Methods and Remarks】
Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is heat treated as specified in No.5.
condition of the one cycle/
stage 1 temperature：minimum usage temperature（－3℃/＋0）for 30±3 min.
stage 2 temperature：＋25℃ for 2 ～3 min.
stage 3 temperature：maximum usage temperature（－0℃/＋3℃）for 30±3min.
stage 4 temperature：＋25℃ for 2 ～3 min.
test cycles：100 times
Solderlands refer to fig.2
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
22. Body strength
Specified Value
No mecanical damage
R=0.5
【Test Methods and Remarks】
applying force : 10N, applying time : 10 seconds
Pressing Jig
Chip
Pressurization
W
L
L ≧
W
0.6L
L
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc09_reli_e-01
mlcc09_reli-P3
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
