STTH1212
Package mechanical data
DIMENSIONS
Table 6.
D2PAK dimensions
REF.
Millimeters
Inches
Min.
Max
Min.
Max.
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
E
C2
L2
L3
D
B2
C
L
A1
C2
D
B2
B
R
C
G
E
A2
G
L
M
*
V2
L2
L3
M
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
0.016 typ.
V2
0°
8°
0°
8°
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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STMICROELECTRONICS [ ST ]
