STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Table 45. DAC characteristics (continued)
Electrical characteristics
Comments
Symbol
Parameter
Min Typ Max(1) Unit
Given for the DAC in 12-bit
configuration
10
3
mV
LSB
LSB
%
Offset error
Given for the DAC in 10-bit at
VREF+ = 3.6 V
(difference between measured value
at Code (0x800) and the ideal value =
VREF+/2)
Offset(3)
Given for the DAC in 12-bit at
12
0.5
VREF+ = 3.6 V
Gain
Given for the DAC in 12bit
configuration
Gain error
error(3)
Settling time (full scale: for a 10-bit
input code transition between the
lowest and the highest input codes
when DAC_OUT reaches final value
1LSB
(
tSETTLING
3
4
1
µs
CLOAD 50 pF, RLOAD 5 k
3)
Max frequency for a correct
DAC_OUT change when small
variation in the input code (from code i
to i+1LSB)
Update
rate(3)
MS/s CLOAD 50 pF, RLOAD 5 k
CLOAD 50 pF, RLOAD 5 k
Wakeup time from off state (Setting
the ENx bit in the DAC Control
register)
(3)
tWAKEUP
6.5
10
µs
input code between lowest and
highest possible ones.
Power supply rejection ratio (to VDDA
(static DC measurement
)
PSRR+ (1)
–67
–40
dB
No RLOAD, CLOAD = 50 pF
1. Guaranteed by characterization, not tested in production.
2. Guaranteed by design, not tested in production.
3. Guaranteed by characterization, not tested in production.
Figure 35. 12-bit buffered /non-buffered DAC
Buffered/Non-buffered DAC
Buffer(1)
R
C
LOAD
DACx_OUT
12-bit
digital to
analog
converter
LOAD
ai17157
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
5.3.18
Temperature sensor characteristics
Doc ID 16455 Rev 2
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STMICROELECTRONICS [ ST ]
