Package information
STA335BW
7
Package information
®
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 14. PowerSSO-36 (slug-up) mechanical data and package dimensions
mm
inch
TYP. MAX.
0.097
DIM.
MIN.
2.15
2.15
0
0.18
0.23
10.10
TYP. MAX. MIN.
2.47 0.084
2.40 0.084
OUTLINE AND
MECHANICAL DATA
A
A2
a1
b
0.094
0.003
0.014
0.012
0.075
0
0.36 0.007
0.32 0.009
10.50 0.398
c
(1)
0.413
D
(1)
E
7.4
7.6
0.291
0.299
e
e3
F
G
G1
H
h
0.5
8.5
2.3
0.019
0.335
0.090
0.004
0.002
0.413
0.016
5˚
0.035
0.169
10˚
0.047
0.031
0.114
0.144
0.039
0.185
0.287
0.10
0.06
10.50 0.398
0.40
10.10
0.55
k
L
5˚
0.90 0.022
10˚
M
N
O
Q
S
T
U
X
4.3
1.2
0.8
2.9
3.65
1.0
PowerSSO-36
(slug-down)
4.1
6.5
4.7
7.3
0.161
0.256
Y
(1) "D” and “E" do not include mold flash or protrusions Mold flash
or protrusions shall not exceed 0.15 mm per side(0.006”)
hx45û
G
LEAD COPLANARITY
A
D
e
Y
T
L
M
BOTTOM VIEW
B
M
A B
0.1
b
e3
7587131 A
52/54
STMICROELECTRONICS [ ST ]
