M41T81
Maximum rating
4
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 6.
Sym
Absolute maximum ratings
Parameter
Value
Unit
Storage temperature (VCC off,
oscillator off)
TSTG
SOIC
–55 to 125
°C
V
Supply voltage
–0.3 to 7
260
V
CC
Lead-free lead finish(1)
°C
Lead solder temperature for 10
seconds
TSLD
Standard (SnPb)
lead finish(2)
240
°C
VIO
IO
Input or output voltages
Output current
–0.3 to Vcc+0.3
V
mA
W
20
1
PD
Power dissipation
1. For SO8 package, lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C for greater
than 30 seconds).
2. For SO8 package, standard (SnPb) lead finish: Reflow at peak temperature of 240°C (total thermal budget not to exceed 180°C for between
90 to 150 seconds).
Caution:
Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-
up Mode
21/30
STMICROELECTRONICS [ ST ]
