ACS102-6T
4 Package information
4.2
SO-8 Mechanical data
DIMENSIONS
Millimetres
Min. Typ. Max. Min. Typ. Max.
REF.
Inches
A
1.350
1.75 0.053
0.250 0.004
1.650 0.043
0.510 0.013
0.250 0.008
5.000 0.189
4.000 0.150
0.069
0.010
0.065
0.020
0.010
0.197
0.157
h x 45°
C
ddd C
(Seating
Plane)
A1 0.100
A2 1.100
0.25mm
(Gage Plane)
A2
A
A1
e
B
k
L
B
C
D
E
0.330
0.190
4.800
3.800
D
8
1
5
4
E
H
e
1.270
0.050
H
h
5.800
0.250
0.400
0°
6.200 0.228
0.500 0.010
1.270 0.016
0.244
0.020
0.050
8°
L
k
8°
0°
ddd
0.100
0.004
Figure 18. SO-8 Footprint
6.8
4.2
0.6
1.27
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
9/11
STMICROELECTRONICS [ ST ]
