P r e l i m i n a r y
TSOP Pin and BGA Package Capacitance
For package types TA, TF, BA, BF, FA, FF (refer to Ordering Information Pages):
Parameter Symbol
Parameter Description
Test Setup
Typ
6
Max
7.5
5.0
12
Unit
pF
TSOP
BGA
C
Input Capacitance
V
= 0
IN
IN
4.2
8.5
5.4
7.5
3.9
pF
TSOP
BGA
pF
C
Output Capacitance
V
= 0
= 0
OUT
OUT
6.5
9
pF
TSOP
BGA
pF
C
Control Pin Capacitance
V
IN
IN2
4.7
pF
For package types TB, TC, BB, BC, (refer to Ordering Information Pages):
Parameter Symbol
Parameter Description
Test Setup
Typ
8
Max
10
10
12
12
10
10
25
20
Unit
pF
pF
pF
pF
pF
pF
pF
pF
TSOP
BGA
C
Input Capacitance
V
= 0
IN
IN
8
TSOP
BGA
8.5
8.5
8
C
Output Capacitance
V
= 0
= 0
= 0
OUT
OUT
TSOP
BGA
C
C
Control Pin Capacitance
V
IN2
IN3
IN
IN
8
TSOP
BGA
20
15
RESET# and WP#/ACC Pin
Capacitance
V
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
144
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00A5 April 30, 2004
SPANSION [ SPANSION ]
