A d v a n c e I n f o r m a t i o n
Physical Dimensions
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
D1
0.20
2X
C
D
A
eD
K
J
H
G
F
E
D
C
B
A
8
7
6
5
4
3
2
1
7
SE
eE
E
E1
A1 CORNER ID.
(INK OR LASER)
B
A1
CORNER
6
NXφb
SD
0.20
2X
C
7
1.00 0.5
TOP VIEW
φ0.25
φ0.10
M
C
C
A B
A1
CORNER
M
BOTTOM VIEW
0.25
C
A
A2
A1
SEATING PLANE
C
0.15
C
SIDE VIEW
NOTES:
PACKAGE
JEDEC
LAA 080
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
N/A
NOTE
13.00 x 11.00 mm
PACKAGE
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
SYMBOL
A
MIN
--
NOM
--
MAX
1.40
--
PROFILE HEIGHT
STANDOFF
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A1
0.40
0.60
--
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
A2
--
--
BODY THICKNESS
BODY SIZE
D
13.00 BSC.
11.00 BSC.
9.00 BSC.
7.00 BSC.
10
E
BODY SIZE
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
MATRIX FOOTPRINT
MATRIX FOOTPRINT
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
E1
MD
ME
N
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
8
80
φb
0.50
0.60
0.70
BALL DIAMETER
8. N/A
eD
1.00 BSC.
1.00 BSC.
0.50 BSC
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
eE
SD/SE
3214\38.12C
90
S29CD032G
30606B0 March 22, 2004
SPANSION [ SPANSION ]
