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AM29BDS643GT7GVAI 参数 Datasheet PDF下载

AM29BDS643GT7GVAI图片预览
型号: AM29BDS643GT7GVAI
PDF下载: 下载PDF文件 查看货源
内容描述: 64兆位(4M ×16位) CMOS 1.8伏只同步读/写,突发模式闪存 [64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory]
分类和应用: 闪存
文件页数/大小: 49 页 / 718 K
品牌: SPANSION [ SPANSION ]
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D A T A S H E E T  
AC Characteristics, Erase and Program Operations  
Corrected t and t to match same specifi-  
cations elsewhere in document.  
REVISION SUMMARY  
WHWH1  
WHWH2  
Revision A (November 1, 2001)  
Initial release.  
Physical Dimensions  
Replaced drawing with updated version.  
Revision A+1 (November 9, 2001)  
Program Command Sequence;  
Table 10, Command Definitions  
Revision A2 (May 8, 2006)  
Added migration/obsolescence information.  
Deleted references to unlock bypass chip and sector  
erase commands.  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-  
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-  
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion LLC will not be liable  
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor  
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design  
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating  
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign  
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-  
thorization by the respective government entity will be required for export of those product.  
Copyright © 2001–2006 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
May 8, 2006 25692A2  
Am29BDS643G  
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