D A T A S H E E T
PHYSICAL DIMENSIONS*
VDA044—44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x 8.0 mm Package
A
D
D1
+0.20
-0.50
1.00
A1 CORNER
A1 ID
0.50 REF
0.50 REF
10 9 8 7 6 5 4 3 2 1
NF1
NF2
e
A
B
E
E1
SE
C
D
1.00
7
NF3
NF4
1.00
SD
7
B
TOP VIEW
φb
6
φ0.05 M C
φ0.15 M C A B
0.10 C
A2
A
BOTTOM VIEW
0.08 C
A1
SEATING PLANE C
SIDE VIEW
NOTES UNLESS OTHERWISE SPECIFIED:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
PACKAGE
VDA 044
JEDEC
N/A
NOTE
9.20 mm x 8.00 mm
PACKAGE
MIN. NOM. MAX.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
SYMBOL
A
A1
A2
D
-
OVERALL THICKNESS
BALL HEIGHT
-
1.00
-
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
0.20
0.64
-
BODY THICKNESS
BODY SIZE
-
0.78
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
8.00 BSC.
9.20 BSC.
E
BODY SIZE
D1
BALL FOOTPRINT
4.50 BSC.
1.50 BSC.
10
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z .
BALL FOOTPRINT
E1
MD
ME
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
4
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
N
44
φb
e
0.25
0.30
0.35
0.50 BSC.
0.25 BSC.
NF1-4
BALL PITCH
SD/SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A
PACKAGE OUTLINE TYPE
* For reference only. BSC is an ANSI standard for Basic Space Centering.
46
Am29BDS643G
25692A2 May 8, 2006
SPANSION [ SPANSION ]
