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AM29BDS640GT93WSF 参数 Datasheet PDF下载

AM29BDS640GT93WSF图片预览
型号: AM29BDS640GT93WSF
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 4MX16, 20ns, PBGA80, 11 X 12 MM, FBGA-80]
分类和应用: 内存集成电路
文件页数/大小: 62 页 / 863 K
品牌: SPANSION [ SPANSION ]
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A D V A N C E I N F O R M A T I O N  
DEVICE BUS OPERATIONS  
This section describes the requirements and use of the  
device bus operations, which are initiated through the  
internal command register. The command register itself  
does not occupy any addressable memory location.  
The register is composed of latches that store the com-  
mands, along with the address and data information  
needed to execute the command. The contents of the  
register serve as inputs to the internal state machine.  
The state machine outputs dictate the function of the  
device. Table 1 lists the device bus operations, the  
inputs and control levels they require, and the resulting  
output. The following subsections describe each of  
these operations in further detail.  
Table 1. Device Bus Operations  
CLK  
(See  
Operation  
CE#  
L
OE#  
L
WE#  
H
A21–0  
Addr In  
Addr In  
Addr In  
Addr In  
HIGH Z  
HIGH Z  
DQ15–0 RESET# Note) AVD#  
Asynchronous Read - Addresses Latched  
Asynchronous Read - Addresses Steady State  
Asynchronous Write  
I/O  
I/O  
H
H
H
H
H
L
X
X
L
L
L
H
L
L
L
H
L
I/O  
Synchronous Write  
L
H
L
I/O  
Standby (CE#)  
H
X
X
X
HIGH Z  
HIGH Z  
X
X
X
X
Hardware Reset  
X
X
Burst Read Operations  
Load Starting Burst Address  
L
L
X
L
H
H
Addr In  
HIGH Z  
X
H
H
Advance Burst to next address with appropriate  
Data presented on the Data Bus  
Burst  
Data Out  
H
Terminate current Burst read cycle  
H
X
X
X
H
H
HIGH Z  
HIGH Z  
HIGH Z  
HIGH Z  
H
L
X
X
Terminate current Burst read cycle via RESET#  
X
Terminate current Burst read cycle and start  
new Burst read cycle  
L
X
H
HIGH Z  
I/O  
H
Legend: L = Logic 0, H = Logic 1, X = Don’t Care, S = Stable Logic 0 or 1 but no transitions.  
Note: Default active edge of CLK is the rising edge.  
Enhanced VersatileIO™ (VIO) Control  
Requirements for Asynchronous Read  
Operation (Non-Burst)  
The Enhanced VersatileIO (VIO) control allows the host  
system to set the voltage levels that the device gener-  
ates at its data outputs and the voltages tolerated at its  
data and address inputs to the same voltage level that  
is asserted on the VIO pin. The device is available with  
either 1.65–1.95 or 2.7–3.15 VIO. This allows the  
device to operate in 1.8 V or 3 V system environments  
as required.  
To read data from the memory array, the system must  
first assert a valid address on A21–A0, while driving  
AVD# and CE# to VIL. WE# should remain at VIH. The  
rising edge of AVD# latches the address. The data will  
appear on DQ15–DQ0. Since the memory array is  
divided into four banks, each bank remains enabled for  
read access until the command register contents are  
altered.  
For example, a VIO of 2.7 – 3.15 volts allows for I/O at  
the 3 volt level, driving and receiving signals to and  
from other 3 V devices on the same bus.  
Address access time (tACC) is equal to the delay from  
stable addresses to valid output data. The chip enable  
access time (tCE) is the delay from the stable  
addresses and stable CE# to valid data at the outputs.  
The output enable access time (tOE) is the delay from  
the falling edge of OE# to valid data at the output.  
10  
Am29BDS640G  
May 9, 2002  
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