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AM29BDS640GT93WSF 参数 Datasheet PDF下载

AM29BDS640GT93WSF图片预览
型号: AM29BDS640GT93WSF
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 4MX16, 20ns, PBGA80, 11 X 12 MM, FBGA-80]
分类和应用: 内存集成电路
文件页数/大小: 62 页 / 863 K
品牌: SPANSION [ SPANSION ]
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A D V A N C E I N F O R M A T I O N  
read mode, active clock edge, RDY configuration, and  
synchronous mode active.  
operation, the system must drive CE#, WE#, and CLK  
to VIL and OE# to VIH when providing an address, com-  
mand, and data. The asynchronous and synchronous  
programing operation is independent of the Set Device  
Read Mode bit in the Burst Mode Configuration Reg-  
ister.  
Handshaking Option  
The device is equipped with a handshaking feature that  
allows the host system to simply monitor the RDY  
signal from the device to determine when the initial  
word of burst data is ready to be read. The host system  
should use the programmable wait state configuration  
to set the number of wait states for optimal burst mode  
operation. The initial word of burst data is indicated by  
the rising edge of RDY after OE# goes low.  
The device features an Unlock Bypass mode to facili-  
tate faster programming. Once the device enters the  
Unlock Bypass mode, only two write cycles are  
required to program a word, instead of four.  
An erase operation can erase one sector, multiple sec-  
tors, or the entire device. Table 8, “Programmable Wait  
State Settings,” on page 22 indicates the address  
space that each sector occupies. The device address  
space is divided into four banks: Banks B and C contain  
only 32 Kword sectors, while Banks A and D contain  
both 8 Kword boot sectors in addition to 32 Kword sec-  
tors. A “bank address” is the address bits required to  
uniquely select a bank. Similarly, a “sector address” is  
the address bits required to uniquely select a sector.  
The presence of the handshaking feature may be veri-  
fied by writing the autoselect command sequence to  
the device. See “Autoselect Command Sequence” for  
details.  
For optimal burst mode performance on devices  
without the handshaking option, the host system must  
set the appropriate number of wait states in the flash  
device depending on clock frequency and the presence  
of a boundary crossing. See “Set Burst Mode Configu-  
ration Register Command Sequence” section on page  
21 section for more information. The device will auto-  
matically delay RDY and data by one additional clock  
cycle when the starting address is odd.  
ICC2 in the DC Characteristics table represents the  
active current specification for the write mode. The AC  
Characteristics section contains timing specification  
tables and timing diagrams for write operations.  
Accelerated Program Operation  
The autoselect function allows the host system to  
determine whether the flash device is enabled for  
handshaking. See the “Autoselect Command  
Sequence” section for more information.  
The device offers accelerated program operations  
through the ACC function. ACC is primarily intended to  
allow faster manufacturing throughput at the factory.  
If the system asserts VID on this input, the device auto-  
matically enters the aforementioned Unlock Bypass  
mode and uses the higher voltage on the input to  
reduce the time required for program operations. The  
system would use a two-cycle program command  
sequence as required by the Unlock Bypass mode.  
Removing VID from the ACC input returns the device to  
normal operation. Note that sectors must be unlocked  
prior to raising ACC to VID. Note that the ACC pin must  
not be at VID for operations other than accelerated pro-  
gramming, or device damage may result. In addition,  
the ACC pin must not be left floating or unconnected;  
inconsistent behavior of the device may result.  
Simultaneous Read/Write Operations with  
Zero Latency  
This device is capable of reading data from one bank  
of memory while programming or erasing in another  
bank of memory. An erase operation may also be sus-  
pended to read from or program to another location  
within the same bank (except the sector being erased).  
Figure 33, “Back-to-Back Read/Write Cycle Timings,”  
on page 59 shows how read and write cycles may be  
initiated for simultaneous operation with zero latency.  
Refer to the DC Characteristics table for  
read-while-program and read-while-erase current  
specifications.  
When at VIL, ACC locks all sectors. ACC should be at  
VIH for all other conditions.  
Writing Commands/Command Sequences  
Autoselect Functions  
The device has the capability of performing an asyn-  
chronous or synchronous write operation. During a  
synchronous write operation, to write a command or  
command sequence (which includes programming  
data to the device and erasing sectors of memory), the  
system must drive AVD# and CE# to VIL, and OE# to  
VIH when providing an address to the device, and drive  
WE# and CE# to VIL, and OE# to VIH. when writing  
commands or data. During an asynchronous write  
If the system writes the autoselect command  
sequence, the device enters the autoselect mode. The  
system can then read autoselect codes from the  
internal register (which is separate from the memory  
array) on DQ15–DQ0. Autoselect mode may only be  
entered and used when in the asynchronous read  
mode. Refer to the “Autoselect Command Sequence”  
section on page 24 section for more information.  
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Am29BDS640G  
May 9, 2002  
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