A D V A N C E I N F O R M A T I O N
CONNECTION DIAGRAM
80-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
C8
D8
E8
F8
G8
H8
J8
K8
L8
M8
NC
A8
B8
NC
NC
NC
NC
NC
NC
VIO
VSSIO
NC
NC
NC
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
L7
M7
NC
VSS
NC
NC
NC
A13
A12
A14
A15
A16
NC
DQ15
C6
A9
D6
A8
E6
F6
G6
H6
J6
K6
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
VCC
WE# RESET#
A21
A19
DQ5
DQ12
DQ4
C4
D4
E4
F4
G4
H4
J4
K4
RDY
ACC
A18
A20
DQ2
DQ10
DQ11
DQ3
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A17
DQ0
DQ8
DQ9
DQ1
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
L2
M2
NC
A2
B2
VSS
CE#
OE#
NC
NC
NC
J1
A1
B1
C1
D1
E1
F1
G1
H1
K1
L1
M1
NC
NC
NC
NC
VCC
CLK
WP#
AVD#
VIO
VSSIO
NC
NC
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
8
Am29BDS640G
October 31, 2002
SPANSION [ SPANSION ]
