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AM29BDD160GB-65ADEK1 参数 Datasheet PDF下载

AM29BDD160GB-65ADEK1图片预览
型号: AM29BDD160GB-65ADEK1
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 512KX32, 67ns, DIE-76]
分类和应用: 内存集成电路
文件页数/大小: 18 页 / 407 K
品牌: SPANSION [ SPANSION ]
 浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第10页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第11页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第12页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第13页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第14页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第16页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第17页浏览型号AM29BDD160GB-65ADEK1的Datasheet PDF文件第18页  
S U P P L E M E N T  
PHYSICAL SPECIFICATIONS  
MANUFACTURING INFORMATION  
Die dimensions . . . . . . . . . . . . . . . 179 mils x 295mils  
. . . . . . . . . . . . . . . . . . . . . . . . . . 4.54 mm x 7.50 mm  
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL  
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KYEC  
Manufacturing ID (Top Boot) . . . . . . . . . . . . .98P03AK  
(Bottom Boot). . . . . . . . 98P03ABK  
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . .500 µm  
Bond Pad Size . . . . . . . . . . . . . . 3.43 mils x 3.43 mils  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 µm x 87 µm  
Preparation for Shipment . . . . . . . . Penang, Malaysia  
Fabrication Process . . . . . . . . . . . . . . . . . . . CS59LS  
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2
Pad Area Free of Passivation . . . . . . . . .264.72 mils  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6,724 µm  
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76  
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu  
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,  
may be grounded (optional)  
SPECIAL HANDLING INSTRUCTIONS  
Processing  
Passivation. . . . . . . . . . . . . . . . . . . . . . . SiN/SOG/SiN  
Do not expose KGD products to ultraviolet light or  
process them at temperatures greater than 250°C.  
Failure to adhere to these handling instructions will  
result in irreparable damage to the devices. For best  
yield, AMD recommends assembly in a Class 10K  
clean room with 30% to 60% relative humidity.  
DC OPERATING CONDITIONS  
V
(Supply Voltage) . . . . . . . . . . . . . .2.5 V to 2.75 V  
CC  
Operating Temperature  
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C  
Extended . . . . . . . . . . . . . . . . . –40°C to +125°C  
Super Extended . . . . . . . . . . . . –40°C to +145°C  
Storage  
Store at a maximum temperature of 30°C in a nitrogen-  
purged cabinet or vacuum-sealed bag. Observe all  
standard ESD handling procedures.  
V
V
Supply Voltages  
IO  
IO  
. . . . . . . . . . . . . . . . . . . . . . . . . . .1.65 V to 2.75 V  
Am29BDD160G Known Good Die—Die Revision 1  
13  
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