CXA3106Q
Package Outline
Unit: mm
48PIN QFP (PLASTIC)
15.3 ± 0.4
+ 0.1
0.15 – 0.05
+ 0.4
12.0 – 0.1
36
25
0.15
24
37
+ 0.2
0.1 – 0.1
48
13
1
12
+ 0.15
0.3 – 0.1
0.8
± 0.12
M
+ 0.35
2.2 – 0.15
PACKAGE STRUCTURE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER / PALLADIUM
PLATING
SONY CODE
EIAJ CODE
QFP-48P-L04
COPPER / 42 ALLOY
0.7g
QFP048-P-1212-B
JEDEC CODE
PACKAGE WEIGHT
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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