FEAST Fast Ethernet Controller for PCMCIA and Generic 16-Bit Applications
FIGURE 18 - 144 PIN TQFP PACKAGE OUTLINES
TABLE 4 - PIN PACKAGE OUTLINE TABLE
MIN
~
NOMINAL
1.0
MAX
1.20
0.15
1.05
22.20
11.10
20.20
22.20
11.10
20.20
0.20
0.75
~
REMARK
Overall Package Height
Standoff
A
A1
A2
D
D/2
D1
E
E/2
E1
H
0.05
0.95
21.80
10.90
19.80
21.80
10.90
19.80
0.09
0.45
~
0.10
1.00
22.00
11.00
20.00
22.00
11.00
20.00
~
0.60
1.00
0.50 Basic
3.5o
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
L
L1
e
Lead Pitch
0o
0.13
0.08
0.08
~
7o
0.23
~
0.20
0.0762
0.08
Lead Foot Angle
W
0.18
~
Lead Width
R1
R2
ccc
ccc
Lead Shoulder Radius
Lead Foot Radius
Max Coplanarity (Assemblers)
Max Coplanarity (Test House)
~
~
~
~
Note 1: Controlling Unit: millimeter
Note 2: Tolerance on the position of the leads is ± 0.04 mm maximum.
Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion
Is 0.25 mm.
Note 4: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-
1.08 mm.
Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DS – LAN91C110 REV. B
Page 54
Rev. 09/05/02
SMSC [ SMSC CORPORATION ]
