High Performance Single Chip Low Power 10/100 Ethernet Physical Layer Transceiver (PHY)
Datasheet
Chapter 7 Package Outline
Figure 7.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 2 MM Footprint
Table 7.1 64 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
D1
E
E1
H
L
~
~
~
~
~
~
~
~
~
1.60
0.15
1.45
12.20
10.20
12.20
10.20
0.20
0.75
~
Overall Package Height
Standoff
0.05
1.35
11.80
9.80
11.80
9.80
0.09
0.45
~
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
0.60
1.00
0.50 Basic
L1
e
Lead Pitch
Lead Foot Angle
Lead Width
o
o
θ
0
~
0.22
~
~
~
7
W
R
R2
ccc
0.17
0.08
0.08
~
0.27
~
0.20
0.08
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LAN83C185
Rev. 0.6 (12-12-03)
DATA5S7HEET
SMSC [ SMSC CORPORATION ]
