iPAC™ FEM FOR QUAD-BAND GSM / GPRS
DATA SHEET • SKY77500
Table 5. Pin Names and Signal Descriptions
Pin
Name
Description
1
2
3
4
5
6
7
8
VCC1C
VCC (to PAC and switch control)
Closed loop PAC mode CMOS enable
VCC (to GSM 1st stage, DCS 1st stages)
Band Select 1 (mode control)
RF input 1710–1910 MHz
PAC ENABLE
VCC1A
BS_1
DCS/PCS_IN
GSM_IN
GND
RF input 824–915 MHz
RF and DC Ground
VCC1B
VCC (to GSM 2nd stage, DCS 2nd stage)
RF and DC Ground
9–14 GND
15
16
17
GSM_RX2
GSM Receive RF output, 869 to 960 MHz
RF and DC Ground
GND
GSM_RX1
GSM Receive RF output, 869 to 960 MHz
RF and DC Ground
Figure 5. SKY77500 FEM Package Pin Configuration – 32-pin
Leadless (Top View)
18–20 GND
21 ANT
22–24 GND
RF IN / RF OUT to Antenna
RF and DC Ground
25
26
27
DCS_RX2
DCS / PCS Receive RF output, 1805–1990 MHz
RF and DC Ground
GND
DCS_RX1
DCS / PCS Receive RF output, 1805–1990 MHz
Feedback voltage for current sense
28
VSENSE
(DO NOT CONNECT THIS PIN ON CIRCUIT BOARD
FOR CLOSED LOOP OPERATION.)
29
30
VBATT
Battery input voltage
VAPC
Power Control bias voltage input
Band Select 2 (mode control)
Transmit / Receive select (mode control)
Ground Pad, bottom of package
31
BS_2
32
TX_RX
(33)
GROUND PAD
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
maximum temperature should not exceed 250 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 250 °C for more
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional
information on standard SMT reflow profiles can also be found in
the JEDEC Standard J-STD-020B.
The SKY77500 is capable of withstanding an MSL 3/250 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 5 °C per second;
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Application
Note: Tape and Reel, Document Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
103146A • Skyworks Proprietary information. • Products and product information are subject to change without notice. • May 16, 2005
15
SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
