DATA SHEET • SKY77500
IPAC™ FEM FOR QUAD-BAND GSM / GPRS
Electrostatic Discharge Sensitivity
The SKY77500 is a Class I device. Figure 7 lists the Electrostatic
Discharge (ESD) immunity level for each pin of the SKY77500
module. The numbers specify the ESD threshold levels for each
pin where the I-V curve between the pin and ground starts to
show degradation. ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts, this so is indicated. If ESD damage threshold below
2000 volts is measured for either polarity, numbers are indicated
that represent worst case values observed in product
Table 6. Precautions for Handling GaAs IC based Products to
Avoid ESD Induced Damage
Wrist Straps
Personnel Grounding
Facility
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Protective Workstation
Static Sensors
characterization.
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks’ most stringent criteria fail devices as soon
as the pin begins to show any degradation on a curve tracer. To
avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed in Table 6.
Protective Packaging and
Transportation
Grounded Carts
Protective Work Order Holders
Technical Information
Closed loop control of the amplifier is enabled when PAC ENABLE
is driven to logic high. The FEM PA collector current will then be
directly proportional to the VAPC input voltage over the range of
400 mV to 2.1 V.
To meet the GSM power versus time mask and switching
transient requirements the FEM must be provided with a DAC
ramp profile on the VAPC input as well as proper timing on digital
controls for the PAC circuitry and transmit/receive switches.
Note: Please refer to 3GPP TS 51.010-1: Mobile Station (MS)
conformance specification. All GSM specifications are
now the responsibility of 3GPP. The standards are
available at http://www.3GPP.org.
The SKY77500 has been designed to comply with interface
requirements and DAC resolution of leading base band devices.
The ramp profile typically consists of a pedestal voltage, 10–16
discrete voltage steps on the rising edge of the burst, a constant
region, 10–16 steps on the falling edge, and a final voltage.
Typically, the user defines the start, stop, and 10–16 percentage
values for each rising and falling edge, which are then applied as
discrete voltages at the VAPC input. For the SKY77500, generally
the same profile, scaled in amplitude, is used for all frequencies
and power control levels. The ultimate purpose is to keep the RF
output power ramp within the time mask and to maintain
acceptable spectral limits at specified offset frequencies. The VAPC
input has an internal reconstruction filter such that external
resistors or capacitors are unnecessary on the phone board or the
test fixture.
Figure 7. ESD Sensitivity Areas (Top View)
Figure 8 represents the dynamic characteristics of the RF output
burst power that results from the ramp profile delivered by the
DAC to the VAPC input. The transmit power must not exceed the
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
May 16, 2005 • Skyworks Proprietary information. • Products and product information are subject to change without notice. • 103146A
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