SiM3C1xx
Table 3.2. Power Consumption (Continued)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
2,3
Power Mode 9 —Low Power
I
RTC Disabled,
—
85
—
nA
DD
Shutdown with VREG0 disabled,
powered through VDD and VIO
V
= 1.8 V, T = 25 °C
A
DD
RTC w/ 16.4 kHz LFO,
= 1.8 V, T = 25 °C
—
—
—
—
—
—
—
—
350
620
145
500
800
300
650
950
—
—
—
—
—
—
—
—
nA
nA
nA
nA
nA
nA
nA
nA
V
DD
A
RTC w/ 32.768 kHz Crystal,
V
V
= 1.8 V, T = 25 °C
DD
A
RTC Disabled,
= 3.0 V, T = 25 °C
DD
A
RTC w/ 16.4 kHz LFO,
= 3.0 V, T = 25 °C
V
DD
A
RTC w/ 32.768 kHz Crystal,
V
= 3.0 V, T = 25 °C
DD
A
2,3
Power Mode 9 —Low Power
I
RTC Disabled,
VREGIN
Shutdown with VREG0 in low-
power mode, VDD and VIO pow-
ered through VREG0 (Includes
VREG0 current)
VREGIN = 5 V, T = 25 °C
A
RTC w/ 16.4 kHz LFO,
VREGIN = 5 V, T = 25 °C
A
RTC w/ 32.768 kHz Crystal,
VREGIN = 5 V, T = 25 °C
A
VIOHD Current (High-drive I/O dis-
abled)
I
HV Mode (default)
LV Mode
—
—
2.5
2
5
µA
nA
VIOHD
—
Notes:
1. Perhipheral currents drop to zero when peripheral clock and peripheral are disabled, unless otherwise noted.
2. Currents are additive. For example, where I is specified and the mode is not mutually exclusive, enabling the
DD
functions increases supply current by the specified amount.
3. Includes all peripherals that cannot have clocks gated in the Clock Control module.
4. Includes supply current from internal regulator and PLL0OSC (>20 MHz) or LPOSC0 (<=20 MHz).
5. Flash execution numbers use 2 wait states for 80 MHz and 0 wait states at 20 MHz or less.
6. RAM execution numbers use 0 wait states for all frequencies.
7. IDAC output current and IVC input current not included.
8. Bias current only. Does not include dynamic current from oscillator running at speed.
8
Preliminary Rev. 0.8
SILICON [ SILICON ]
