Si1000/1/2/3/4/5
Table 4.20. Auxiliary Block Specifications1
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Temperature Sensor
Accuracy
TS
After calibrated via sen-
sor offset register
tvoffs[7:0]
—
0.5
—
°C
A
2
Temperature Sensor
Sensitivity
TS
—
—
5
50
250
—
—
—
mV/°C
mV
S
2
Low Battery Detector
LBD
RES
2
Resolution
Low Battery Detector
LBD
—
—
µs
CT
2
Conversion Time
Microcontroller Clock
Output Frequency
F
Configurable to
30 MHz, 15 MHz,
10 MHz, 4 MHz, 3 MHz,
2 MHz, 1 MHz, or
32.768 kHz
32.768K
30M
Hz
MC
General Purpose ADC
Resolution
ADC
ADC
—
—
—
8
4
—
—
—
bit
mV/bit
µs
ENB
RES
2
General Purpose ADC Bit
2
Resolution
Temp Sensor & General
Purpose ADC Conversion
ADC
305
CT
2
Time
30 MHz XTAL Start-Up time
t
Using XTAL and board
layout in reference
design. Start-up time
will vary with XTAL type
and board layout.
—
—
600
97
—
—
µs
fF
30M
30 MHz XTAL Cap
30M
See “Crystal Oscillator”
on page 260 for total
load capacitance
calculation
RES
2
Resolution
2
32 kHz XTAL Start-Up Time
t
—
—
6
—
—
sec
32k
32 kHz Accuracy using
32KRC
1000
ppm
RES
2
Internal RC Oscillator
32 kHz RC Oscillator Start-
Up
t
—
500
—
µs
32kRC
POR Reset Time
t
—
—
16
—
—
ms
µs
POR
2
Software Reset Time
t
250
soft
Notes:
1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max
limits are listed in the "Production Test Conditions" section on page 73.
2. Guaranteed by qualification. Qualification test conditions are listed in the "Production Test Conditions" section
on page 73.
70
Rev. 1.0
SILICON [ SILICON ]
