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EFM32G200F16G-E-QFN32R 参数 Datasheet PDF下载

EFM32G200F16G-E-QFN32R图片预览
型号: EFM32G200F16G-E-QFN32R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microcontroller,]
分类和应用: 时钟微控制器外围集成电路
文件页数/大小: 205 页 / 3175 K
品牌: SILICON [ SILICON ]
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EFM32G Data Sheet  
LQFP100 Package Specifications  
7. LQFP100 Package Specifications  
7.1 LQFP100 Package Dimensions  
Figure 7.1. LQFP100  
Note:  
1. Datum 'T', 'U' and 'Z' to be determined at datum plane 'H'  
2. Datum 'D' and 'E' to be determined at seating plane datum 'Y'.  
3. Dimension 'D1' and 'E1' do not include mold protrusions. Allowable protrusion is 0.25 per side. Dimensions 'D1' and 'E1' do include  
mold mismatch and are determined at datum plane datum 'H'.  
4. Dimension 'b' does not include dambar protrusion. Allowable dambar protrusion shall not cause thelead width to exceed the maxi-  
mum 'b' dimension by more than 0.08 mm. Dambar can not be locatedon the lower radius or the foot. Minimum space between  
protrusion and an adjacent lead is 0.07 mm.  
5. Exact shape of each corner is optional.  
Table 7.1. LQFP100 (Dimensions in mm)  
SYMBOL  
MIN  
NOM  
MAX  
1.6  
total thickness  
stand off  
A
A1  
A2  
b
0.05  
1.35  
0.17  
0.17  
0.09  
0.09  
0.15  
1.45  
0.27  
0.23  
0.2  
mold thickness  
lead width (plating)  
lead width  
1.4  
0.2  
b1  
c
L/F thickness (plating)  
lead thickness  
c1  
0.16  
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