EFM32G Data Sheet
BGA112 Package Specifications
6. BGA112 Package Specifications
6.1 BGA112 Package Dimensions
BOTTOM VIEW
TOP VIEW
SIDE VIEW
Figure 6.1. BGA112
Note:
1. The dimensions in parenthesis are reference.
2. Datum 'C' and seating plane are defined by the crown of the solder balls.
3. All dimensions are in millimeters.
The BGA112 Package uses SAC105 solderballs.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
For additional Quality and Environmental information, please see: http://www.silabs.com/support/quality/pages/default.aspx.
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