SC4215
POWER MANAGEMENT
Outline Drawing - SOIC-8EDP
A
D
E
e
N
DIMENSIONS
INCHES MILLIMETERS
DIM
A
MIN NOM MAX MIN NOM MAX
2X E/2
-
-
-
-
-
-
-
-
-
-
.053
.069 1.35
.005 0.00
.065 1.25
.020 0.31
.010 0.17
1.75
0.13
1.65
0.51
0.25
A1 .000
A2 .049
E1
b
c
.012
.007
1
2
D
E1
E
.189 .193 .197 4.80 4.90 5.00
.150 .154 .157 3.80 3.90 4.00
ccc C
.236 BSC
.050 BSC
6.00 BSC
1.27 BSC
2X N/2 TIPS
e/2
e
F
h
.086 .090 .094 2.19 2.29 2.39
B
-
-
.010
.020 0.25
0.50
L
.016 .028 .041 0.40 0.72 1.04
D
F
(.041)
(1.05)
L1
N
8
8
aaa C
-
-
01
aaa
0°
8°
0°
8°
A2
A
.004
.010
.008
0.10
0.25
0.20
SEATING
bbb
ccc
PLANE
C
A1
bxN
bbb
C A-B D
h
EXPOSED PAD
h
H
F
c
GAGE
PLANE
0.25
L
(L1)
01
DETAIL A
SEE DETAIL A
SIDE VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION BA.
Land Pattern - SOIC-8EDP
SOLDER MASK
DIM
E
D
DIMENSIONS
INCHES
(.205)
.098
MILLIMETERS
(5.20)
2.49
5.10
2.44
3.00
1.27
0.60
2.20
7.40
C
D
E
F
Z
(C)
G
Y
F
.201
.096
G
P
X
Y
Z
.118
.050
.024
THERMAL VIA
Ø 0.36mm
P
.087
X
.291
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.
REFERENCE IPC-SM-782A, RLP NO. 300A.
3.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
2006 Semtech Corp.
8
www.semtech.com
SEMTECH [ SEMTECH CORPORATION ]
