SC4215
POWER MANAGEMENT
Ordering Information
Part Number
SC4215ISTR(1)
SC4215ISTRT(1)(2)
SC4215EVB
Package
Temp. Range (TJ)
SOIC-8EDP
-40 to +125OC
Evaluation Board
Notes:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices for the SOIC-8EDP package.
(2) Lead-free product. This product is fully WEEE and
RoHS compliant.
Pin Configuration
Top View
Bottom View
GND
GND
ADJ
VO
NC
EN
VIN
NC
GND
ADJ
VO
8
7
6
5
NC
EN
VIN
NC
1
2
3
4
Exposed
Die Pad
NC
NC
SOIC-8EDP
SOIC-8EDP
Pin Descriptions
Pin # Pin Name Pin Desciption
2
3
EN
Enable Input. Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a
fraction of its operating value. The device will be enabled if this pin is left open. Connect to VIN if not
being used.
VIN
Input voltage. For regulation at full load, the input to this pin must be between (VO+ 0.5V) and 5.5V.
Minimum VIN = 1.6V. A large bulk capacitance should be placed closely to this pin to ensure that the
input supply does not sag below 1.6V. Also a minimum of 4.7uF ceramic capacitor should be placed
directly at this pin.
6
7
VO
The pin is the power output of the device. A minimum of 10uF capacitor should be placed directly at
this pin.
ADJ
When this pin is grounded, an internal resistor divider sets the output voltage to 2.5V. If connected
to the Vo pin, the output voltage will be set at 0.8V. If external feedback resistors are used, the output
voltage will be (See Application Circuits on page 1):
0.8 (R1 + R2)
VO
=
Volts
R2
8
GND
NC
Reference ground. The GND pin and the exposed die pad must be connected together at the IC pin.
No Connection.
1,4,5
THERMAL Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not electrically connected
PAD internally.
2006 Semtech Corp.
4
www.semtech.com
SEMTECH [ SEMTECH CORPORATION ]
