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K9F4G08U0D-SIB0000 参数 Datasheet PDF下载

K9F4G08U0D-SIB0000图片预览
型号: K9F4G08U0D-SIB0000
PDF下载: 下载PDF文件 查看货源
内容描述: 产品选型指南三星半导体公司内存+存储 [Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage]
分类和应用: 半导体存储
文件页数/大小: 28 页 / 930 K
品牌: SAMSUNG [ SAMSUNG ]
 浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第7页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第8页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第9页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第10页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第12页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第13页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第14页浏览型号K9F4G08U0D-SIB0000的Datasheet PDF文件第15页  
coMPonent drAM orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
K
4
T
XX  
XX  
X
X
X
X
X
XX  
SAMSUNG Memory  
DRAM  
Speed  
Temp & Power  
Package Type  
Revision  
DRAM Type  
Density  
Interface (VDD, VDDQ)  
Bit Organization  
Number of Internal Banks  
08: x8  
1. Memory (K)  
2. DRAM: 4  
9. Package Type  
15: x16 (2CS)  
16: x16  
DDR SDRAM  
L: TSOP II (Lead-free & Halogen-free)  
H: FBGA (Lead-free & Halogen-free)  
F: FBGA for 64Mb DDR (Lead-free & Halogen-free)  
6: sTSOP II (Lead-free & Halogen-free)  
T: TSOP II  
26: x4 Stack (JEDEC Standard)  
27: x8 Stack (JEDEC Standard)  
30: x32 (2CS, 2CKE)  
31: x32 (2CS)  
3. DRAM Type  
B: DDR3 SDRAM  
D: GDDR SDRAM  
G: GDDR5 SDRAM  
H: DDR SDRAM  
J: GDDR3 SDRAM  
M: Mobile SDRAM  
N: SDDR2 SDRAM  
S: SDRAM  
32: x32  
N: sTSOP II  
6. # of Internal Banks  
G: FBGA  
U: TSOP II (Lead-free)  
2: 2 Banks  
3: 4 Banks  
4: 8 Banks  
5: 16 Banks  
V: sTSOP II (Lead-free)  
Z: FBGA (Lead-free)  
DDR2 SDRAM  
T: DDR SDRAM  
Z: FBGA (Lead-free)  
U: GDDR4 SDRAM  
7. Interface ( VDD, VDDQ)  
J: FBGA DDP (Lead-free)  
V: Mobile DDR SDRAM Power Efficient Address  
W: SDDR3 SDRAM  
2: LVTTL, 3.3V, 3.3V  
4: LVTTL, 2.5V, 2.5V  
5: SSTL-2 1.8V, 1.8V  
6: SSTL-15 1.5V, 1.5V  
8: SSTL-2, 2.5V, 2.5V  
A: SSTL, 2.5V, 1.8V  
F: POD-15 (1.5V,1.5V)  
H: SSTL_2 DLL, 3.3V, 2.5V  
M: LVTTL, 1.8V, 1.5V  
N: LVTTL, 1.5V, 1.5V  
P: LVTTL, 1.8V, 1.8V  
Q: SSTL-2 1.8V, 1.8V  
R: SSTL-2, 2.8V, 2.8V  
U: DRSL, 1.8V, 1.2V  
Q: FBGA QDP (Lead-free)  
H: FBGA (Lead-free & Halogen-free)  
M: FBGA DDP (Lead-free & Halogen-free)  
E: FBGA QDP (Lead-free & Halogen-free)  
T: FBGA DSP (Lead-free & Halogen-free, Thin)  
X: Mobile DDR SDRAM  
Y: XDR DRAM  
Z: Value Added DRAM  
4. Density  
DDR3 SDRAM  
10: 1G, 8K/32ms  
Z: FBGA (Lead-free)  
16: 16M, 4K/64ms  
26: 128M, 4K/32ms  
28: 128M, 4K/64ms  
32: 32M, 2K/32ms  
50: 512M, 32K/16ms  
51: 512M, 8K/64ms  
52: 512M, 8K/32ms  
54: 256M, 16K/16ms  
55: 256M, 4K/32ms  
56: 256M, 8K/64ms  
62: 64M, 2K/16ms  
64: 64M, 4K/64ms  
68: 768M, 8K/64ms  
1G: 1G, 8K/64ms  
H: FBGA (Halogen-free & Lead-free)  
Graphics Memory  
Q: TQFP  
U: TQFP (Lead Free)  
G: 84/144 FBGA  
V: 144 FBGA (Lead Free)  
Z: 84 FBGA(Lead Free)  
T: TSOP  
8. Revision  
A: 2nd Generation  
B: 3rd Generation  
C: 4th Generation  
D: 5th Generation  
E: 6th Generation  
F: 7th Generation  
G: 8th Generation  
H: 9th Generation  
I: 10th Generation  
J: 11th Generation  
K: 12th Generation  
M: 1st Generation  
N: 14th Generation  
Q: 17th Generation  
L: TSOP (Lead Free)  
A: 136 FBGA  
B: 136 FBGA(Lead Free)  
H: FBGA(Hologen Free & Lead Free)  
E: 100 FBGA(Hologen Free & Lead Free)  
2G: 2G, 8K/64ms  
SDRAM  
4G: 4G, 8K/64ms  
L TSOP II (Lead-free & Halogen-free)  
N: STSOP II  
5. Bit Organization  
T: TSOP II  
02: x2  
U: TSOP II (Lead-free)  
V: sTSOP II (Lead-free)  
04: x4  
06: x4 Stack (Flexframe)  
07: x8 Stack (Flexframe)  
www.samsung.com/semi/dram  
2H 2010  
DRAM Ordering Information  
11  
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