DDR SDRAM 256Mb E-die (x4, x8)
DDR SDRAM
System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR333, DDR266 & DDR200 devices to ensure
proper system performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
AC CHARACTERISTICS
DDR333
DDR266
DDR200
PARAMETER
SYMBOL
DCSLEW
MIN
TBD
MAX
TBD
MIN
TBD
MAX
TBD
MIN
0.5
MAX
4.0
Units
V/ns
Notes
a, m
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Input Slew Rate
0.5 V/ns
∆tIS
0
∆tIH
0
Units
ps
Notes
i
i
i
0.4 V/ns
+50
+100
0
ps
0.3 V/ns
0
ps
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Input Slew Rate
0.5 V/ns
∆tDS
0
∆tDH
0
Units
ps
Notes
k
k
k
0.4 V/ns
+75
+150
+75
+150
ps
0.3 V/ns
ps
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Delta Slew Rate
+/- 0.0 V/ns
∆tDS
0
∆tDH
0
Units
ps
Notes
j
j
j
+/- 0.25 V/ns
+/- 0.5 V/ns
+50
+100
+50
+100
ps
ps
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Typical Range
(V/ns)
Minimum
(V/ns)
Maximum
(V/ns)
Slew Rate Characteristic
Notes
Pullup Slew Rate
Pulldown slew
1.2 ~ 2.5
1.2 ~ 2.5
1.0
1.0
4.5
4.5
a,c,d,f,g,h
b,c,d,f,g,h
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Typical Range
(V/ns)
Minimum
(V/ns)
Maximum
(V/ns)
Slew Rate Characteristic
Notes
Pullup Slew Rate
Pulldown slew
1.2 ~ 2.5
1.2 ~ 2.5
0.7
0.7
5.0
5.0
a,c,d,f,g,h
b,c,d,f,g,h
Table 7 : Output Slew Rate Matching Ratio Characteristics
AC CHARACTERISTICS DDR266B
DDR200
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
MIN
TBD
MAX
TBD
MIN
0.67
MAX
1.5
Notes
e,m
Rev. 1.3 April, 2005
SAMSUNG [ SAMSUNG ]
