Product Guide
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Org.
128Mx 72
Density
1GB
Part Number
M393B2873EH1
M393B2873FH0
M393B5673EH1
M393B5673FH0
256Mx 72
2GB
M393B5670EH1
M393B5670FH0
M393B5773CH0
M393B5173EH1
M393B5173FH0
M393B5170EH1
512Mx 72
4GB
M393B5170FH0
M393B5273BH1
M393B5273CH0
M393B5270BH1
M393B5270CH0
M393B1G70EM1
M393B1K73BH1
1Gx 72
8GB
M393B1K73CH0
M393B1K70BH1
M393B1K70CH0
M393B2K70BM1
2Gx 72
16GB
M393B2K70CM0
M393B2G70AH0
M393B2G73AH0
4Gx 72
32GB
M393B4G70AH0
Speed
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8
YF8
YF8/H9
YF8/H9
YF8/H9
YF8
F(4Rx4)
YF8/H9
YF8/H9
YF8/H9
YF8/H9
E(2Rx4)
H(4Rx8)
AB(4Rx4)
Raw Card
A(1Rx8)
Composition
128M x 8 *
128M x 8 *
9 pcs
9 pcs
Comp.
Version
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
2Gb
1Gb
1Gb
1Gb
1Gb
2Gb
2Gb
2Gb
2Gb
1Gb
2Gb
2Gb
2Gb
2Gb
2Gb
2Gb
4Gb
4Gb
4Gb
E-die
F-die
E-die
F-die
E-die
F-die
C-die
E-die
F-die
E-die
F-die
B-die
C-die
B-die
C-die
E-die
B-die
C-die
B-die
C-die
B-die
C-die
A-die
A-die
A-die
May. 2010
DDR3 SDRAM Memory
Internal
Banks
8
Rank
1
PKG
78 ball
FBGA
Height
30mm
Avail.
Now
NOTE
B(2Rx8)
128M x 8 * 18 pcs
128M x 8 * 18 pcs
256M x 4 * 18 pcs
256M x 4 * 18 pcs
256M x 8 *
9 pcs
8
2
78 ball
FBGA
30mm
Now
C(1Rx4)
A(1Rx8)
H(4Rx8)
8
1
128M x 8 * 36 pcs
128M x 8 * 36 pcs
256M x 4 * 36 pcs
256M x 4 * 36 pcs
256M x 8 * 18 pcs
256M x 8 * 18 pcs
512M x 4 * 18 pcs
512M x 4 * 18 pcs
DDP
x 4 * 36 pcs
512M
256M x 8 * 36 pcs
256M x 8 * 36 pcs
512M x 4 * 36 pcs
512M x 4 * 36 pcs
DDP
x 4 * 36 pcs
1G
DDP
x 4 * 36 pcs
1G
1G x 4 * 36 pcs
512M x 8 * 36 pcs
DDP
x 4 * 36 pcs
2G
8
4
E(2Rx4)
8
2
78 ball
FBGA
30mm
Now
B(2Rx8)
8
2
C(1Rx4)
F(4Rx4)
H(4Rx8)
8
8
8
1
4
4
78 ball
FBGA
30mm
Now
E(2Rx4)
8
2
8
4
78 ball
FBGA
30mm
Now
8
4
78 ball
FBGA
30mm
Now
*
NOTE
: 1.35V product is 1.5V operatable.
-8-
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
