Product Guide
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Org.
Density
Part Number
M471B2873EH1
128Mx 64
1GB
M471B2874EH1
M471B2873FHS
M471B5673EH1
256Mx 64
2GB
M471B5673FH0
M471B5773CHS
512Mx 64
1Gx 64
4GB
8GB
M471B5273BH1
M471B5273CH0
M471B1G73AH0
Speed
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
Raw Card
B(1Rx8)
A(2Rx16)
B(1Rx8)
F(2Rx8)
B(1Rx8)
F(2Rx8)
F(2Rx8)
Composition
128M x 8 * 8 pcs
64M x 16 * 8 pcs
64M x 16 * 8 pcs
128M x 8 * 16 pcs
128M x 8 * 16 pcs
256M x 8 * 8 pcs
256M x 8 * 16 pcs
256M x 8 * 16 pcs
512M x 8 * 16 pcs
Comp.
Version
1Gb
1Gb
1Gb
1Gb
1Gb
2Gb
2Gb
2Gb
4Gb
E-die
E-die
F-die
E-die
F-die
C-die
B-die
C-die
A-die
May. 2010
DDR3 SDRAM Memory
Internal
Banks
8
8
8
8
8
8
8
Rank
1
2
1
2
1
2
2
PKG
78 ball
FBGA
96 ball
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
Height
Avail.
NOTE
30mm
Now
30mm
Now
30mm
30mm
Now
Now
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Org.
128Mx 64
256Mx 64
Density
1GB
2GB
Part Number
M471B2873FHS
M471B5673FH0
M471B5773CHS
M471B5273BH1
M471B5273CH0
M471B1G73AH0
Speed
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
Raw Card
B(1Rx8)
F(2Rx8)
B(1Rx8)
F(2Rx8)
F(2Rx8)
Composition
128M x 8 * 8 pcs
128M x 8 * 16 pcs
256M x 8 * 8 pcs
256M x 8 * 16 pcs
256M x 8 * 16 pcs
512M x 8 * 16 pcs
Comp.
Version
1Gb
1Gb
2Gb
2Gb
2Gb
4Gb
F-die
F-die
C-die
B-die
C-die
A-die
Internal
Banks
8
8
8
8
8
Rank
1
2
1
2
2
PKG
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
Height
30mm
30mm
Avail.
Now
Now
NOTE
512Mx 64
1Gx 64
4GB
8GB
30mm
30mm
Now
Now
*
NOTE
: 1.35V product is 1.5V operatable.
-6-
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
