Product Guide
6. Package Dimension
May. 2010
DDR3 SDRAM Memory
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
0.10MAX
#A1
B
7.50
±
0.10
11.00
±
0.10
1.10
±
0.10
7.50
±
0.10
0.80 x 8 = 6.40
(Datum A)
0.80 1.60
3.20
A
#A1 INDEX MARK
9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
(0.95)
MOLDING AREA
(1.90)
4.80
(Datum B)
0.80 x 12 = 9.60
0.80
11.00
±
0.10
78 -
∅0.45
Solder ball
(Post Reflow
∅0.05 ±
0.05)
0.2 M A B
Bottom
Top
96Ball FBGA for 1Gb E-die (x16)
A
#A1 INDEX MARK
B
#A1
0.10MAX
7.50
±
0.10
13.30
±
0.10
1.10
±
0.10
7.50
±
0.10
0.80 x 8 = 6.40
0.80 1.60
3.20
9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
(0.95)
MOLDING AREA
(1.90)
(Datum A)
0.80 x 15 = 12.00
0.80
13.30
±
0.10
96 -
∅0.45
Solder ball
(Post Reflow
∅0.05 ±
0.05)
0.2 M A B
Bottom
Top
- 12 -
0.50
±
0.05
0.35
±
0.05
(Datum B)
0.40
6.00
0.50
±
0.05
0.35
±
0.05
0.80
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
