Product Guide
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
May. 2010
DDR3 SDRAM Memory
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
1. Memory Module : M
8. Component Revision
M
:
1st Gen.
B
:
3rd Gen.
D
:
5th Gen.
F
:
7th Gen.
Speed
Temp & Power
PCB Revision
Package
Component Revision
2. DIMM Type
3
:
DIMM
4
:
SODIMM
3. Data Bits
71 :
78 :
91 :
92 :
93 :
x64
x64
x72
x72
x72
204pin Unbuffered SODIMM
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
:
FBGA(Lead-free)
Z
:
FBGA(Lead-free & Halogen-free)
H
:
FBGA(Lead-free, DDP)
J
M
:
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0
:
None
2
:
2nd Rev.
4
:
4th Rev.
1
:
1st Rev.
3
:
3rd Rev.
S
:
Reduced Layer
4. DRAM Component Type
B
:
DDR3 SDRAM (1.5V VDD)
5. Depth
32
:
32M
64
:
64M
28
:
128M
56
:
256M
51
:
512M
1G
:
1G
2G
:
2G
33
65
29
57
52
1K
2K
:
32M (for 128Mb/512Mb)
:
64M (for 128Mb/512Mb)
:
128M (for 128Mb/512Mb)
:
256M (for 512Mb/2Gb)
:
512M (for 512Mb/2Gb)
:
1G (for 2Gb)
:
2G (for 2Gb)
11. Temp & Power
C
:
Commercial Temp.( 0°C ~ 85°C) & Normal Power
Y
:
Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Banks in comp. & Interface
7
:
8Banks & SSTL-1.5V
12. Speed
F7
:
DDR3-800
F8
:
DDR3-1066
H9
:
DDR3-1333
K0
:
DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
NOTE:
PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0
:
x4
3
:
x8
4
:
x16
-4-
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
