Product Guide
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
May. 2010
DDR3 SDRAM Memory
9
10
11
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (V
DD
, V
DDQ
)
# of Internal Banks
1. SAMSUNG Memory : K
7. Interface ( V
DD
, V
DDQ
)
6
:
SSTL (1.5V, 1.5V)
2. DRAM : 4
8. Revision
3. DRAM Type
B
:
DDR3 SDRAM
M
A
B
C
D
E
F
G
H
:
1st Gen.
:
2nd Gen.
:
3rd Gen.
:
4th Gen.
:
5th Gen.
:
6th Gen.
:
7th Gen
:
8th Gen
:
9th Gen
4. Density
51
:
512Mb
1G
:
1Gb
2G
:
2Gb
4G
:
4Gb
9. Package Type
5. Bit Organization
04
:
x 4
08
:
x 8
16
:
x16
Z
H
J
M
:
:
:
:
FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C
:
Commercial Temp.( 0°C ~ 85°C) & Normal Power
L
:
Commercial Temp.( 0°C ~ 85°C) & Low Power
Y
:
Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3
:
4 Banks
4
:
8 Banks
5
:
16 Banks
11. Speed
F7
:
DDR3-800
F8
:
DDR3-1066
H9
:
DDR3-1333
K0
:
DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
-2-
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
