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RT8859M 参数 Datasheet PDF下载

RT8859M图片预览
型号: RT8859M
PDF下载: 下载PDF文件 查看货源
内容描述: 多相PWM控制器,用于CPU核心供电 [Multi-Phase PWM Controller for CPU Core Power Supply]
分类和应用: 多相元件控制器
文件页数/大小: 51 页 / 729 K
品牌: RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
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RT8859M  
the AXG VR will trigger UVP latch. The UVP latch will  
turn off both high side and low side MOSFETs. When  
ROC1b  
=
(α 1)×ROC2 + α ×REQU, HOT REQU, COLD  
(1− α)  
(69)  
UVP is triggered by the AXG VR, the CORE VR will also  
where  
α =  
enter soft shut down sequence. A 3μs delay is used in  
UVP detection circuit to prevent false trigger. If platform  
OFSA function is enabled (OFSA pin not connected to  
GND), the UVP function will be disabled.  
RSENSE, HOT  
DCR25°C ×[1+ 0.00393×(THOT 25)]  
=
RSENSE, COLD DCR25°C ×[1+ 0.00393×(TCOLD 25)]  
(70)  
REQU, T°C = ROC1a // RNTC, T°C  
(71)  
Under Voltage Lock Out (UVLO)  
During normal operation, if the voltage at the VCC orDVD  
pin drops below POR threshold, the AXG VR will trigger  
UVLO. The UVLO protection forces all high side MOSFETs  
and low side MOSFETs off by shutting down internal PWM  
logic driver. A3μs delay is used in UVLO detection circuit  
to prevent false trigger.  
Over Voltage Protection (OVP)  
The over voltage protection circuit of theAXGVR monitors  
the output voltage via the ISENAN pin after POR. The  
supported maximum operating VID of the VR (V(MAX) ) is  
stored in the VOUT_Max register. Once VISENAN  
exceeds V(MAX) + 150mV, OVP is triggered and latched.  
The AXG VR will try to turn on low side MOSFETs and  
turn off high side MOSFETs of the AXGVR to protect the  
CPU. When OVP is triggered by the AXGVR, the CORE  
VR will also enter shut down sequence. A 1μs delay is  
used in OVP detection circuit to prevent false trigger.Note  
that if OFSA pin is higher than 0.9V before power up,  
OVP would trigger when VMAX + 850mV.  
Inductor Selection  
The switching frequency and ripple current determine the  
inductor value as follows :  
V
IN VOUT  
LMIN  
=
× TON  
(72)  
IRipple(MAX)  
where tON is the UGATE turn-on period.  
Higher inductance yields in less ripple current and hence  
higher efficiency. The downside is a slower transient  
response of the power stage to load transients. This might  
increase the need for more output capacitors, thus driving  
up the cost. Select a low loss inductor having the lowest  
possibleDC resistance that fits in the allotted dimensions.  
The core must be large enough not to be saturated at the  
peak inductor current.  
Negative Voltage Protection (NVP)  
During OVP latch state, the AXG VR also monitors the  
ISENAN pin for negative voltage protection. Since the OVP  
latch will continuously turn on all low side MOSFETs of  
the AXG VR, the AXG VR may suffer negative output  
voltage. As a consequence, when the ISENAN voltage  
drops below 0.05V after triggering OVP, theAXGVR will  
trigger NVP to turn off all low side MOSFETs of the AXG  
VR while the high side MOSFETs still remaining off. After  
triggering NVP, if the output voltage rises above 0V, the  
OVP latch will restart to turn on all low side MOSFETs.  
Therefore, the output voltage may bounce between 0V  
and 0.05V due to OVP latch and NVP triggering. The  
NVP function will be active only after OVP is triggered. A  
1μs delay is used inNVP detection circuit to prevent false  
trigger.  
Output Capacitor Selection  
Output capacitors are used to obtain high bandwidth for  
the output voltage beyond the bandwidth of the converter  
itself. Usually, the CPU manufacturer recommends a  
capacitor configuration. Two different kinds of output  
capacitors are typically used : bulk capacitors closely  
located next to the inductors, and ceramic output  
capacitors in close proximity to the load. Latter ones are  
for mid-frequency decoupling with especially small ESR  
and ESL values, while the bulk capacitors have to provide  
enough stored energy to overcome the low frequency  
bandwidth gap between the regulator and the CPU.  
Under Voltage Protection (UVP)  
TheAXGVR implements under voltage protection of VOUT,  
AXG. If VFBA is less than the internal reference by 300mV,  
Copyright 2012 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
48  
DS8859M-05 July 2012  
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