TG-201902141228EP
Cautions
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use
the picking up nozzle, the pressure on the silicone resin should be proper. LED
(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering,
do not warp the circuit board.LED
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering. Do not rapidly cool device after soldering.
4. Handling Precautions
4.1 Handling Precautions
(1) LED operating environment and sulfur element composition cannot be over 100PPM in the
LED mating usage material. This is provided for informational purposes only and is not a warranty
or endorsement.LED
(2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the
malfunction of LED, the single content of Bromine element is required to be less than
900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total
content of Bromine element and Chlorine element in the external materials of the application
products is required to be less than 1500PPM. This is provided for informational purposes only
and is not a warranty or endorsement.
Tel: +86-755-66839118 Fax:+86-755-66839300 E-mail:sales@refond.com Web: www.refond.com
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REFOND [ SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. ]
