Internet Data Sheet
HYS72T[128/256]00xHR–[3S/3.7/5]–A
Registered DDR2 SDRAM Modules
3.3
AC Characteristics
3.3.1
Speed Grades Definitions
TABLE 11
Speed Grade Definition
Speed Grade
DDR2–667
–3S
DDR2–533C
DDR2–400B
Unit
Note
QAG Sort Name
CAS-RCD-RP latencies
Parameter
–3.7
–5
5–5–5
4–4–4
Min.
3–3–3
tCK
Symbol
@ CL = 3 tCK
@ CL = 4 tCK
@ CL = 5 tCK
tRAS
Min.
Max.
Max.
Min.
Max.
—
1)2)3)4)
1)2)3)4)
1)2)3)4)
1)2)3)4)5)
1)2)3)4)
1)2)3)4)
1)2)3)4)
Clock Frequency
5
8
5
8
5
8
ns
ns
ns
ns
ns
ns
ns
3.75
3
8
3.75
3.75
45
8
5
8
8
8
5
8
Row Active Time
Row Cycle Time
RAS-CAS-Delay
Row Precharge Time
45
60
15
15
70000
—
70000
—
40
55
15
15
70000
—
tRC
60
tRCD
tRP
—
15
—
—
—
15
—
—
1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode. Timings are further guaranteed for normal
OCD drive strength (EMRS(1) A1 = 0) under the “Reference Load for Timing Measurements”
2) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS,
input reference level is the crosspoint when in differential strobe mode.
3) Inputs are not recognized as valid until VREF stabilizes. During the period before VREF stabilizes, CKE = 0.2 x VDDQ is recognized as low.
4) The output timing reference voltage level is VTT
.
5) RAS.MAX is calculated from the maximum amount of time a DDR2 device can operate without a refresh command which is equal to 9 x tREFI
t
.
3.3.2
AC Timing Parameters
TABLE 12
DRAM Component Timing Parameter by Speed Grade - DDR2–667
Parameter
Symbol
DDR2–667
Unit
Note1)2)3)4)5)6)7)
8)
Min.
Max.
9)
DQ output access time from CK / CK
CAS to CAS command delay
Average clock high pulse width
Average clock period
tAC
–450
2
+450
—
ps
tCCD
nCK
tCK.AVG
ps
10)11)
tCH.AVG
tCK.AVG
0.48
3000
0.52
8000
Rev. 1.4, 2007-02
16
03062006-GD6J-14FP