BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
JULY 1994 - REVISED SEPTEMBER 1997
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
D008
Designation per JEDEC Std 30:
PDSO-G8
5,00 (0.197)
4,80 (0.189)
8
7
6
5
6,20 (0.244)
5,80 (0.228)
4,00 (0.157)
3,81 (0.150)
1
2
3
4
7° NOM
3 Places
1,75 (0.069)
1,35 (0.053)
5,21 (0.205)
4,60 (0.181)
0,50 (0.020)
0,25 (0.010)
x 45°NOM
0,203 (0.008)
0,102 (0.004)
7° NOM
4 Places
0,51 (0.020)
0,36 (0.014)
8 Places
4° ± 4°
0,79 (0.031)
0,28 (0.011)
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
0,229 (0.0090)
0,190 (0.0075)
1,12 (0.044)
0,51 (0.020)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
MDXXAA
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
P R O D U C T
I N F O R M A T I O N
9
POINN [ POWER INNOVATIONS LTD ]
