BULD25D, BULD25DR, BULD25SL
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
JULY 1994 - REVISED SEPTEMBER 1997
MECHANICAL DATA
SL003
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SL003
4,57 (0.180)
MAX
10,2 (0.400) MAX
6,60 (0.260)
6,10 (0.240)
8,31 (0.327)
MAX
Index
Dot
12,9 (0.492)
MAX
4,267 (0.168)
MIN
1
2
3
Pin Spacing
2,54 (0.100) T.P.
(see Note A)
2 Places
0,356 (0.014)
0,203 (0.008)
3 Places
1,854 (0.073) MAX
0,711 (0.028)
0,559 (0.022)
3 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
MDXXAD
NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
P R O D U C T
I N F O R M A T I O N
10
POINN [ POWER INNOVATIONS LTD ]
