PAH8002EP-2P Product Datasheet
Low Power Optical Heart Rate Detection Chip
PixArt Imaging Inc.
4.4.2 Recommended Layout Information of Main Board
4.4.2.1 Pad Dimension on PCB/FPC
1. Pad size design:
. If use solder mask defined (SMD), pad size is referred as solder mask opening size.
. If use non-solder mask defined (non-SMD), pad size is referred as copper metal size.
2. Recommended dimension of pad is shown in below figure. The actual pad size design will need to consider
components aside.
(Refer to Figure 9. Recommended Layout PCB).
Notes: All dimension is mm.
Figure 9. Recommended Layout PCB
4.4.2.2 Recommended Stiffener type for FPC (Flex) back‐side (at Sensor package area)
1. If use FPC (Flex) board, stiffener is required to be added onto the back of FPC (Flex) to enhance the Flex strength.
2. Recommended Stiffener type: FR4 or stainless steel.
3. Recommended stiffener thickness: minimum 0.4mm for FR4 type, minimum 0.15mm for stainless steel.
4.4.2.3 Recommended use 0.1~0.12mm thickness stencil for SMT process.
1. The stencil thickness selection will need to consider passive component size aside package.
2. In case of the package is surface mounted on FPCB (Flexible Printed Circuit Boards), the overall thickness of cover layer
& adhesive layer is recommenced to be controlled under than 40µm.
Version 1.3 | 25 Sep 2017 | 31007AEN
PixArt Imaging Inc. http://www.pixart.com
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