PAH8002EP-2P Product Datasheet
Low Power Optical Heart Rate Detection Chip
PixArt Imaging Inc.
4.5 Recommend Guideline for PCB Assembly
Recommended vendor and type for Pb-free solder paste
. Almit LFM-48W TM-HP
. Senju M705-GRN360-K
IR Reflow Soldering Profile can be refer to Figure 11. IR Reflow Soldering Profile.
Temperature profile is the most important control in reflow soldering. It must be fine-tuned to establish a robust process.
The typical recommended IR reflow profile is:
Figure 11. IR Reflow Soldering Profile
Note:
(1) Average Ramp-up Rate (30℃ to preheat zone): 1.5~2.5℃/Sec
(2) Preheat zone:
(2.1) Temperature ramp from 170~200℃
(2.2) Exposure time: 90 +/- 30 sec
(3) Melting zone:
(3.1) Melting area temperature > 220℃ for at least 30~50sec
(3.2) Peak temperature: 245℃
MS Level: MS Level 3
Version 1.3 | 25 Sep 2017 | 31007AEN
PixArt Imaging Inc. http://www.pixart.com
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