TDA8944J
2 x 7 W stereo BTL audio amplifier
Philips Semiconductors
Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
8.1
8.2
Functional description . . . . . . . . . . . . . . . . . . . 4
Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 5
Output power measurement . . . . . . . . . . . . . . . 5
Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Switch-on and switch-off. . . . . . . . . . . . . . . . . . 6
Supply Voltage Ripple Rejection (SVRR). . . . . 6
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
Thermal shutdown protection . . . . . . . . . . . . . . 6
8.2.1
8.2.2
8.3
8.3.1
8.4
8.5
8.5.1
8.5.2
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 13
Printed-circuit board (PCB). . . . . . . . . . . . . . . 13
Layout and grounding. . . . . . . . . . . . . . . . . . . 13
Power supply decoupling . . . . . . . . . . . . . . . . 14
Thermal behaviour and heatsink calculation . 15
14.1
14.1.1
14.1.2
14.2
15
15.1
15.2
Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15
16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
17
17.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering by dipping or by solder wave . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
17.2
17.3
17.4
18
19
20
21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
© Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 February 2000
Document order number: 9397 750 06861
NXP [ NXP ]
