TDA8922B
Philips Semiconductors
2 × 50 W class-D power amplifier
15. Package outline
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
12
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
24
13
w
M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.7
2.2
3.5
3.2
mm
1
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-02-18
03-07-23
SOT566-3
Fig 27. HSOP24 package outline.
9397 750 13357
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 — 1 October 2004
26 of 32
NXP [ NXP ]
