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TDA8357 参数 Datasheet PDF下载

TDA8357图片预览
型号: TDA8357
PDF下载: 下载PDF文件 查看货源
内容描述: 全桥垂直偏转输出电路LVDMOS [Full bridge vertical deflection output circuit in LVDMOS]
分类和应用:
文件页数/大小: 16 页 / 100 K
品牌: NXP [ NXP ]
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Philips Semiconductors  
Preliminary specification  
Full bridge vertical deflection output circuit  
in LVDMOS  
TDA8357J  
Heatsink calculation  
The required heatsink thermal resistance is given by:  
The value of the heatsink can be calculated in a standard  
way with a method based on average temperatures.  
The required thermal resistance of the heatsink is  
determined by the maximum die temperature of 150 °C.  
In general we recommend to design for an average die  
temperature not exceeding 130 °C.  
Tj T  
Rth(h a)  
=
amb (R th(j c) + Rth(c h)  
)
-----------------------  
Ptot  
When we use the values given we find:  
110 40  
Rth(h a)  
=
(5 + 2) = 16 K/W  
----------------------  
3.0  
The heatsink temperature will be:  
Th = Tamb + (Rth(h-a) × Ptot) = 40 + (3 × 16) = 90 °C  
EXAMPLE  
Measured or given values: Ptot = 3 W; Tamb = 40 °C;  
Tj = 110 °C; Rth(j-c) = 5 K/W; Rth(c-h) = 2 K/W.  
1999 Nov 10  
11  
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