Philips Semiconductors
Preliminary specification
Full bridge vertical deflection output circuit
in LVDMOS
TDA8357J
PACKAGE OUTLINE
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
q
1
non-concave
x
E
h
D
h
D
D
view B: mounting base side
1
P
A
2
k
q
2
B
E
q
L
3
L
2
L
1
L
1
9
e
w
M
Q
c
v
M
Z
1
b
p
e
m
e
2
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(2)
(1)
(2)
(1)
(1)
UNIT A
b
c
D
D
D
E
E
e
e
e
k
L
L
L
L
m
P
Q
q
q
q
2
v
w
x
Z
2
p
1
h
h
1
2
1
2
3
1
2.7 0.80 0.58 13.2 6.2
2.3 0.65 0.48 12.8 5.8
14.7
14.3
3.0 12.4 11.4 6.7 4.5
2.0 11.0 10.0 5.5 3.7
3.4
3.1
1.65
1.10
1.15 17.5
0.85 16.3
3.8
3.6
mm
3.5
3.5 2.54 1.27 5.08
2.8
4.85
0.8
0.3 0.02
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D may protrude 0.04 mm maximum.
1
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
98-11-12
SOT523-1
1999 Nov 10
14
NXP [ NXP ]
