PCF8566
NXP Semiconductors
Universal LCD driver for low multiplex rates
15. Bare die outline
Wire bond die; 40 bonding pads; 2.5 x 2.91 x 0.381 mm
PCF8566U
D
e
A
P C 8 5 6 6 - 1
25
24
23
22
21
20
19
18
17
16
C1
15
e
26
14
13
12
F
27
28
29
30
31
32
33
34
11
10
9
x
E
0
0
y
8
C2
P
P
3
4
7
35
6
P
P
2
36
37
38
39
40
1
2
3
4
5
1
X
detail X
0
0.5
scale
1 mm
DIMENSIONS (mm are the original dimensions)
(1)
(2)
(1)
(2)
UNIT
A
D
E
e
P
P
P
P
4
1
2
3
max 0.406
0.548
mm
nom 0.381 2.5
min 0.356
2.91 0.200 0.12 0.106 0.12 0.106
0.018
Notes
1. Pad size
2. Passivation opening
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
08-06-19
08-09-03
PCF8566U
Fig 31. Bare die outline PCF8566U
PCF8566_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 25 February 2009
39 of 48
NXP [ NXP ]
