PCF8566
NXP Semiconductors
Universal LCD driver for low multiplex rates
Table 22. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 31).
Symbol
S21
Pad
38
X (µm)
−630
−430
−230
Y (µm)
−1235
−1235
−1235
Description
S22
39
S23
40
REF
C1
REF
F
REF
001aai300
C2
Fig 32. Alignment marks
Table 23. Alignment marks
Symbol
X (µm)
1100
325
Y (µm)
C1
C2
F
1090
−625
700
−790
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
17. Packing information
Tray information for the PCF8566U is shown in Figure 33, Figure 35 and Table 24.
PCF8566_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 25 February 2009
41 of 48
NXP [ NXP ]
