ISP1362
Single-chip USB OTG controller
Philips Semiconductors
21. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
y
X
A
48
33
Z
49
32
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
64
17
detail X
1
16
Z
v
M
A
D
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
D
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 10.1 10.1
0.17 0.12 9.9 9.9
12.15 12.15
11.85 11.85
0.75
0.45
1.45 1.45
1.05 1.05
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT314-2
136E10
MS-026
Fig 39. LQFP64 package outline.
9397 750 12337
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 03 — 06 January 2004
143 of 150
NXP [ NXP ]
