ISP1362
Single-chip USB OTG controller
Philips Semiconductors
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm
SOT543-1
D
A
B
ball A1
index area
A
2
A
E
A
1
detail X
C
e
1
y
y
e
1/2
e
v
M
M
b
C
C
A
B
C
1
w
K
J
H
G
F
e
e
2
E
D
C
B
A
1/2
e
ball A1
index area
1
2
3
4
5
6
7
8
9 10
X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
e
y
D
E
e
e
2
v
w
y
1
1
max.
0.25 0.85 0.35
0.15 0.75 0.25
6.1
5.9
6.1
5.9
mm
1.1
0.08
0.5
4.5
4.5
0.15 0.05
0.1
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
00-11-22
02-04-09
SOT543-1
- - -
MO-195
- - -
Fig 40. TFBGA64 package outline.
9397 750 12337
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 03 — 06 January 2004
144 of 150
NXP [ NXP ]
