ISP1160
Embedded USB Host Controller
Philips Semiconductors
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
22. Revision history
Table 77: Revision history
Rev Date
CPCN
-
Description
04 20030704
Product data (9397 750 11371)
Modifications:
• Table 1: added type numbers /01
• Table 2: updated description for pin 40
• Section 6: changed active LOW pin names into NAME_N; also changed pin names in
figures and parameters in dynamic characteristics tables
• Section 9.4.1: removed the last bullet list under the examples on legal uses of the internal
FIFO buffer RAM
• Section 9.5: updated last paragraph
• Table 8: changed reset value to 10H
• Table 9: updated
• Table 46: updated the chip ID
• Section 13: added (new)
• Table 68: updated the table note
• Deleted section Timing symbols (old section 17.1).
Product data (9397 750 10765)
Product data (9397 750 09628)
Objective data (9397 750 09161)
03 20030227
02 20020912
01 20020104
-
-
-
9397 750 11371
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 04 — 04 July 2003
86 of 88
NXP [ NXP ]
