ISP1160
Embedded USB Host Controller
Philips Semiconductors
LQFP64: plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm
SOT414-1
y
X
A
48
33
49
32
Z
E
e
A
2
A
H
E
E
(A )
3
A
1
w M
p
θ
b
pin 1 index
L
p
L
64
17
detail X
1
16
Z
v M
A
D
e
w M
b
p
D
B
H
v M
B
D
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.
7o
0o
0.15 1.45
0.05 1.35
0.23 0.20 7.1
0.13 0.09 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.64 0.64
0.36 0.36
1.6
mm
0.25
0.4
1
0.2 0.08 0.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-20
SOT414-1
136E06
MS-026
Fig 44. LQFP64 (SOT414-1) package outline.
9397 750 11371
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 04 — 04 July 2003
83 of 88
NXP [ NXP ]
