Philips Semiconductors
BUK9528-55A; BUK9628-55A
TrenchMOS™ logic level FET
9. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
P
A
A1
q
D1
mounting
base
D
L2
(1)
L1
Q
L
b1
1
2
3
b
c
e
e
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
4.5
4.1
A1
1.39
1.27
b
0.9
0.7
b1
1.3
1.0
c
0.7
0.4
D
15.8
15.2
D1
6.4
5.9
E
10.3
9.7
e
2.54
L
15.0
13.5
L1
3.30
2.79
L2
max.
3.0
(1)
P
3.8
3.6
q
3.0
2.7
Q
2.6
2.2
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
SOT78
REFERENCES
IEC
JEDEC
3-lead TO-220AB
EIAJ
SC-46
EUROPEAN
PROJECTION
ISSUE DATE
99-09-13
00-09-07
Fig 16. SOT78 (TO-220AB).
9397 750 07683
© Philips Electronics N.V. 2001. All rights reserved.
Product specification
Rev. 01 — 18 January 2001
9 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
